We offer a variety of customized services for special types of applications or specific products. Please use these links to learn more about each service.
ASIC Design Services
We offer custom integrated circuit design of analog mixed-signal solutions for aerospace, avionics, defense, industrial and automotive companies.
Clock and Timing Services
Our specialized services will help with the planning, deployment and maintenance of your synchronization infrastructure.
FPGA and SoC Services
Take advantage of our initial design, first article, prototyping, volume programming and other services that support your FPGA and SoC design flow.
Foundry Services
We can help you manufacture custom projects on 150 or 200 mm wafer diameters at one of our three IATF-16949 certified wafer fabs located in the United States.
Microelectronics Assembly Services
Meet your Size, Weight and Power (SWaP) requirements with our wafer probe, wafer sawing, die attach, wire bonding, flip chip, encapsulation, surface mount assembly, test, CAD and embedding services.
Miniaturization Services
Our embedded System-In-Package (SiP) technology provides unparalleled miniaturization in a proven and robust package capable of meeting the most stringent quality requirements.
Module and Hybrid Design Services
We offer custom design and manufacturing of modules and hybrids for aerospace, defense, space and industrial applications.
Power Module Services
Our Si IGBT and SiC MOSFET technologies significantly improve power density. We offer heavy-gauge wire bonding, silicon potting, film-assisted molding, silver sintering and tab welding services
Programming Services
Our online Programming Center is a quick, secure and inexpensive way to order production programming of our microcontroller and memory devices.
Rugged Power Supply Design
Explore our range of design engineering capabilities for creating rugged power supplies used in military and space applications.