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Optimized to Deliver the Lowest Total Power Solution


PolarFire® FPGAs deliver up to 50% lower power than competitive devices. The images are identical designs are running on similar devices. Seeing is believing.

Microchip MPF300T 2.7W, 36°C, 5 FIT

Microchip Polarfire FPGA 3.5W, 59.8°C, 24.2 FIT, 28nm

Competitor X 5.5W, 68°C, 50 FIT

Competitor X FPGA 6.0W, 81.3°C, 96.3 FIT, 16nm

Benefits of Our Low-Power FPGAs


Microchip FPGAs and SoC FPGAs consume up to 50% lower total power than competitive FPGAs. Our nonvolatile process delivers FPGA families that are live at power-up with minimal in-rush current, and significantly lower leakage than SRAM-based alternatives. Take it one step further; run a power benchmark with our power estimator. Seeing is believing.

  • Fanless enclosures with small/no heat sink
  • Increased thermal headroom for more compute capability

PolarFire FPGAs and PolarFire SoCs—Low Power by Design


The PolarFire family of devices is built and designed for low power. We use a proven low-power 28 nm CMOS process for wafer fabrication and we’ve designed the FPGA fabric for low static power consumption. We also use state-of-the art transceiver designs to minimize total transceiver power. The PolarFire FPGA delivers the lowest power in the smallest form factors in a mid-range FPGA to give you more compute capability within a fixed power or thermal budget.

FPGA and SoC Low Power by Design

Best-In-Class Performance and Power


The CoreMarks® per Watt benchmark measures the power consumption of competitive SoC FPGAs using available power estimators. The entire device is powered while only the processor subsystem is operating. It is a chip-to-chip comparison, not a CPU-to-CPU comparison. Power is measured at worst-case process and 100°C Tj.

CoreMarks per Watt benchmark

New PolarFire MPFS025 SoC Performance


New PolarFire MPFS025 SoC Performance

Effect of Temperature on Device Reliability


The Failure in Time (FIT) rate roughly doubles with every ten-degree rise in temperature. Lower temperatures lead to lower FIT rates. PolarFire FPGAs can reduce your overall system FIT rate.

Effect of Temperature on Device Reliability

Thermal Runaway


Thermal runaway can be a problem for SRAM FPGAs. Use power estimators to sweep the temperature to determine when a heat sink is needed for SRAM FPGAs.

Thermal Model Capped

Features


Minimal In-Rush and Zero Configuration Current

Minimal In-Rush and Zero Configuration Current

SRAM FPGAs require a complex power up and reset sequencing. High in-rush currents occur during device initialization and configuration. Leveraging our SoC FPGAs simplifies sequencing requirements and components, reducing system cost, design complexity and board space.

Instant-on FPGAs Power-up Sequence

Instant On

Our instant-on FPGAs assist in system startup tasks, system configuration and supervision. Instant-on functionality simplifies power-up sequence requirements with fewer components and lower cost while enhancing security and reducing initialization time.

PolarFire® and PolarFire SoC FPGAs Power Solutions Reference Guide


Find the right power solution combination for PolarFire or PolarFire SoC FPGAs. Our reference guide highlights Microchip power management products that are proven to shorten your prototype development cycle.