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With demanding environments, thermal constraints and extreme security requirements, designing effective defense systems is a challenge. Choosing the right FPGA supplier is critical to your long-term mission success.

Security


  • Extensive anti-tamper capabilities that enable foreign military sales
  • Cryptographically assured supply chain
  • Side channel-resistant crypto co-processor
  • Dual Physically Unclonable Function (PUF)

Full Temperature Grade Offerings to Meet Defense Requirements 


  • Lower power to meet rugged thermal environments
  • Industrial (−40°C to 100°C), automotive (−40°C to 125°C) and military (−55°C to 125°C) temperature ranges
  • Rugged military temperature packages

Unrivaled Power Efficiency for a Mid-Range FPGA


Compare the power efficiency between our PolarFire FPGA and a leading FPGA from one of our competitors.

Microchip MPF300T 2.7W, 36°C, 5 FIT

Microchip PolarFire FPGA 3.5W, 59.8°C, 24.2 FIT, 28 nm

  • 3.5W
  • 59.8°C
  • 24.2 FIT
  • 28 nm
Competitor X 5.5W, 68°C, 50 FIT

Competitor X FPGA 6.0W, 81.3°C, 96.3 FIT, 16nm

  • 6.0W
  • 81.3°C
  • 96.3 FIT
  • 16 nm

Explore Our FPGAs and SoCs To Build Your Defense Infrastructure


Anti-Tamper Features


The PolarFire family of products contains extensive anti-tamper features to customize your response to the threats your equipment may face:

  • Three analog windowed voltage detectors giving you high and low trip points for each critical supply (Vdd, Vdd18, Vdda25)
  • A digital windowed temperature sensor providing you a high and low die temperature.
  • Raw voltage and temperature values from the built-in sensors

Explore the Anti-Tamper Features of Our FPGAs


Flag Name

Description

MESH_ERROR

Active mesh tamper flag. This flag is asserted whenever the active security mesh observes a mismatch between the actual metal mesh output and the expected output. This allows protection against invasive attacks, such as cutting and probing of traces using Focused Ion Beam (FIB) technology with an active metal mesh on one of the higher metal layers.

CLOCK_MONITOR_GLITCH

Asserted whenever the clock glitch monitor detects a pulse width violation.

CLOCK_MONITOR_FREQUENCY

Asserted whenever the clock frequency monitor observes a frequency mismatch between the 160 MHz and 2 MHz RC oscillators.

SCB_BUS_ERROR

Asserted when an error has been detected on the system controller bus.

LOCK_ERROR

Asserted when a single- or double-bit error is detected in the continuously monitored security lock segments.

DIGEST

Asserted when a requested digest check fails.

INST_BUFFER_ACCESS

The flag is asserted when read/write access is performed to system controller’s shared buffer using JTAG/SPI interface.

INST_DEBUG

Asserted when debug instruction executed.

INST_CHECK_DIGESTS

Asserted when an external digest check has been requested.

INST_EC_SETUP

Asserted when elliptic curve slave instructions have been used.

INST_FACTORY_PRIVATE

Asserted when factory JTAG/SPI instruction is executed.

INST_KEY_VALIDATION

Asserted when key validation protocol is requested.

INST_MISC

Asserted when uncategorized SPI slave instruction executed.

INST_PASSCODE_MATCH

Asserted when an attempt has made to match a passcode.

INST_PASSCODE_SETUP

Asserted when the one-time passcode protocol is initiated.

INST_PROGRAMMING

Asserted when an external programming instruction has been used.

INST_PUBLIC_INFO

Asserted when a request for device public information is issued.

INST_PASSCODE_FAIL

Asserted when the passcode match fails.

INST_KEY_VALIDATION_FAIL

Asserted when the key validation fails.

INST_UNUSED

Asserted when the unused instruction opcode is executed.

BITSTREAM_AUTHENTICATION_FAIL

Asserted when the bitstream authentication fails.

IAP_AUTO_UPDATE

Asserted if an IAP update occurs (either by IAP system service or auto-update at device boot).

IAP_AUTO_RECOVERY

Asserted if the IAP recovery procedure occurs.

TeraFire EXP-F5200B


Our PolarFire FPGAs include the TeraFire EXP-F5200B cryptography microprocessor. With a comprehensive suite of cryptographic algorithms, strong DPA countermeasures, high performance and CAVP certifications, PolarFire FPGAs break new ground in bringing strong cryptography to the FPGA market.

TeraFire EXP-F5200B-Supported Protocols/Features


  • TRNG: SP800-90A CTR_DRBG-256; SP800-90B (draft) NRBG
  • AES-128/192/256 E/D (ECB, CBC, CTR, OFB, CFB, GCM, Key wrap)
  • SHA-1/224/256/384/512
  • HMAC-SHA-1/224/256/384/512; GMAC-AES; CMAC-AES
  • SHA-256 Key Tree
  • ECC: NIST P256/384/521 and Brainpool P256/384/512 curves
  • KeyGen, KAS - ECC CDH, ECDSA SigGen and SigVer, PKG, PKV
  • IFC:  1024/1536/2048/3072/4096
  • RSA E/D; SSA_PKCS1_V1_5 SigGen and SigVer; ANSI X9.31 SigGen and SigVer
  • FFC: 1024/1536/2048/3072/4096
  • KAS—DH, DSA SigGen and SigVer

TeraFire EXP-F5200B NIST CAVP Certifications Available


PUFs


Two PUFs in one:
  • SRAM-PUF
  • Bus-keeper PUF
The entire PUF is power gated.

Full Temperature Range Offerings for PolarFire FPGAs


Features

MPF050T

MPF100T

MPF200T

MPF300T

MPF500T

 

Total User IO (HSIO/GPIO) SGMII CDRs/XCVRs

FCSG325
(11 × 11, 11 × 14.5*, 0.5 mm)

164 (84/80) 6/4

170 (84/86) 7/4

170 (84/86) 7/4*

 

 

FCSG536
(16 × 16, 0.5 mm)

   

300 (120/180) 15/4

300 (120/180) 15/4

 

FCVG484
(19 × 19, 0.8 mm)

176 (96/92) 7/4

284 (120/164) 13/4

284 (120/164)13/4

284 (120/164) 13/4

 

FCG484
(23 × 23, 1.0 mm)

 

244 (96/148) 12/8

244 (96/148) 12/8

244 (96/148) 12/8

 

FCG784
(29 × 29, 1.0 mm)

   

364 (132/232) 18/16

388 (156/232) 18/16

388(156/232) 18/16

FCG1152
(35 × 35, 1.0 mm)

   

 

512 (276/236) 19/16

584(324/260) 19/24

*Devices in the same package and family type are pin compatible.

Features

MPF050T

MPF100T

MPF200T

MPF300T

MPF500T

 

Total User IO (HSIO/GPIO) SGMII CDRs/XCVRs

FCS325
(11 × 14.5, 0.5 mm)

 

 

170 (84/86) 7/4*

 

 

FCS536
(16 × 16, 0.5 mm)

 

 

 

300 (120/180) 15/4

 

FCV484
(19 × 19, 0.8 mm)

 

 

 

284 (120/164) 13/4

 

FC484
(23 × 23, 1.0 mm)

 

 

 

244 (96/148) 12/8

 

FC784
(29 × 29, 1.0 mm)

 

 

 

388 (156/232) 18/16

388(156/232) 18/16

FC1152
(35 × 35, 1.0 mm)

 

 

 

 

584(324/260) 19/24

*Devices in the same package and family type are pin compatible.

Features

MPF050T

MPF100T

MPF200T

MPF300T

MPF500T

 

Total User IO (HSIO/GPIO) SGMII CDRs/XCVRs

FCSG325
(11 × 11, 11 × 14.5*, 0.5 mm)

164 (84/80) 6/4

170 (84/86) 7/4

170 (84/86) 7/4*

 

 

FCSG536
(16 × 16, 0.5 mm)

   

300 (120/180) 15/4

300 (120/180) 15/4

 

FCVG484
(19 × 19, 0.8 mm)

176 (96/92) 7/4

284 (120/164) 13/4

284 (120/164)13/4

284 (120/164) 13/4

 

FCG484
(23 × 23, 1.0 mm)

 

244 (96/148) 12/8

244 (96/148) 12/8

 

 

FCG784
(29 × 29, 1.0 mm)

 

 

 

 

 

FCG1152
(35 × 35, 1.0 mm)

 

 

 

 

 

*Devices in the same package and family type are pin compatible.

Full Temperature Range Offerings for System on Chip (SoC) FPGAs


Features

MPFS025T

MPFS095T

MPFS160T

MPFS250T

MPFS460T

 

MSS IO/HSIO/GPIO/XCVRs

FCSG325
(11 × 11, 0.5 mm) 

102/32/48/2

102/32/48/2

     

FCSG536
(16 × 16, 0.5 mm) 

 

136/60/84/4

136/60/108/4

136/60/108/4

 

FCVG484
(19 × 19, 0.8 mm) 

136/60/48/4

136/60/84/4

136/60/84/4

136/60/84/4

 

FCVG784
(23 × 23, 0.8 mm) 

 

136/144/132/4

136/144/168/8

136/144/180/8

 

FCG1152
(35 × 35, 1.0 mm) 

     

136/144/228/16

136/180/288/20

*Devices in the same package and family type are pin compatible.

Features

MPFS025T

MPFS095T

MPFS160T

MPFS250T

MPFS460T

 

MSS IO/HSIO/GPIO/XCVRs

FCSG325
(11 × 11, 0.5 mm) 

 

102/32/48/2

     

FCSG536
(16 × 16, 0.5 mm) 

     

136/60 /108/4

 

FCVG484
(19 × 19, 0.8 mm) 

     

136/60/84/4

 

FCVG784
(23 × 23, 0.8 mm) 

     

136/144/180/8

 

FCG1152
(35 × 35, 1.0 mm) 

     

136/144/228/16

136/180/288/20

*Devices in the same package and family type are pin compatible.

Features

MPFS025T

MPFS095T

MPFS160T

MPFS250T

MPFS460T

 

MSS IO/HSIO/GPIO/XCVRs

FCSG325
(11 × 11, 0.5 mm) 

102/32/48/2

102/32/48/2

     

FCSG536
(16 × 16, 0.5 mm) 

 

136/60/84/4

136/60/108/4

136/60/108/4

 

FCVG484

(19 × 19, 0.8 mm) 

136/60/48/4

136/60/84 /4

136/60/84/4

136/60/84/4

 

FCVG784
(23 × 23, 0.8 mm) 

 

136/144/132/4

136/144/168/8

136/144/180/8

 

FCG1152
(35 × 35, 1.0 mm) 

       

136/180/288/20

*Devices in the same package and family type are pin compatible.

Ruggedized Defense Packages


OPN

Pitch

Dimensions

Vents

Package Caps

MPF200TS-FCS325M

0.5 mm

11 × 14.5

-

-

MPF300TS-FC484M

1.0 mm

23 × 23

N, S, E, W

Yes

MPF300TS-FCV484M

0.8 mm

19 × 19

E, W

Yes

MPF300TS-FCS536M

0.5 mm

16 × 16

-

-

MPF300TS-FC784M

1.0 mm

29 × 29

E, W

Yes

MPF500TS-FC784M

1.0 mm

29 × 29

E, W

Yes

MPF500TS-FC1152M

1.0 mm

35 × 35

N, S, E, W

Yes

*Notes

  • Two- and four-sided vents to enable flushing of caustic agents
  • Sn/Pb balls and Sn/Pb decoupling cap solder paste
  • Wafer bumps with underfill