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FPGA Packaging

To enable next-generation silicon technologies, semiconductor packages have evolved to provide improved performance and flexibility in smaller sizes. Our popular high-density FPGA families, including our PolarFire®, PolarFire SoC, SmartFusion® 2, IGLOO® 2, ProASIC® 3 and IGLOO FPGA families, are packaged in small-form-factor packages to give you the freedom to innovate with smaller devices.

Our true Flash-based FPGAs do not require the external configuration memories that are usually required for SRAM-based FPGAs. SRAM configuration memories typically are available in 8-pin or 16-pin SOICs. These devices consume an additional 30 to 100 mm2 of additional PCB real estate depending on the selected device. Our FPGAs also do not need to be power sequenced, saving the additional cost of developing a power sequencing solution and the subsequent recurring costs of additional silicon.

Smallest Form Factor Solutions

Product Tables

Type (Size, Pitch)

MPF050T

MPF100T

MPF200T

MPF300T

MPF500T

FCSG325 (11 × 11, 0.5 mm)

Yes

Yes

Yes

 

 

FCSG325 (11 × 14.5, 0.5 mm)

Yes

Yes

Yes

 

 

FCSG536 (16 × 16, 0.5 mm)

 

 

Yes

Yes

 

FCVG484 (19 × 19, 0.8 mm)

Yes

Yes

Yes

Yes

 

FCG484 (23 × 23, 1.0 mm)

 

Yes

Yes

Yes

 

FCG784 (29 × 29, 1.0 mm)

 

 

Yes

Yes

Yes

FCG1152 (35 × 35, 1.0 mm)

 

 

 

Yes

Yes

Type (Size, Pitch)

MPFS025T

MPFS095T

MPFS160T

MPFS250T

MPFS460T

FCSG325 (11 × 11, 0.5 mm)

Yes

 

 

 

 

FCSG325 (11 × 14.5, 0.5 mm)

 

Yes

 

 

 

FCSG536 (16 × 16, 0.5 mm)

 

Yes

Yes

Yes

 

FCVG484 (19 × 19, 0.8 mm)

Yes

Yes

Yes

Yes

 

FCVG784 (23 × 23, 0.8 mm)

 

Yes

Yes

Yes

 

FCG1152 (35 × 35, 1.0 mm)

 

 

 

Yes

Yes

Type (Size, Pitch)

M2GL005/M2S005

M2GL010/M2S010

M2GL025/M2S025

M2GL050/M2S050

M2GL060/M2S060

M2GL090/M2S090

M2GL150/M2S150

FCSG158 (9 × 9, 0.5 mm)*

 

 

Yes

 

 

 

 

FCS325 (11 × 11, 0.5 mm)

 

 

Yes

Yes

Yes

Yes

 

VF256 (14 × 14, 0.8 mm)

Yes

Yes

Yes

 

 

 

 

FCS536 (16 × 16, 0.5 mm)

 

 

 

 

 

 

Yes

VF400 (17 × 17, 0.8 mm)

Yes

Yes

Yes

Yes

Yes

 

 

FCV484 (19 × 19, 0.8 mm)

 

 

 

 

 

 

Yes

TQ144 (20 × 20, 0.5 mm)

Yes

Yes

 

 

 

 

 

FG484 (23 × 23, 1.0 mm)

Yes

Yes

Yes

Yes

Yes

Yes

 

FG676 (27 × 27, 1.0 mm)

 

 

 

 

Yes

Yes

 

VFG784 (23 × 23, 0.8 mm)

 

 

 

 

Yes

 

 

FG896 (31 × 31, 1.0 mm)

 

 

 

Yes

 

 

 

FC1152 (35 × 35, 1.0 mm)

 

 

 

 

 

 

Yes

*The M2GL025 device does not support this package

Type (Size, Pitch)

A3P030

A3P060

A3P125

A3P250/M1A3P250

A3P400/M1A3P400

A3P600/M1A3P600

A3P1000/M1A3P1000

QN48 (6 × 6, 0.4 mm)

Yes

 

 

 

 

 

 

QN68 (8 × 8, 0.5 mm)

Yes

 

 

 

 

 

 

VQ100 (14 × 14, 0.5 mm)

Yes

Yes

Yes

Yes

 

 

 

TQ144 (20 × 20, 0.5 mm)

 

Yes

Yes

 

 

 

 

PQ208 (28 × 28, 0.5 mm)

 

 

Yes

Yes

Yes

Yes

Yes

FG144 (13 × 13, 1.0 mm)

 

Yes

Yes

Yes

Yes

Yes

Yes

FG256 (17 × 17, 1.0 mm)

 

 

 

Yes*

Yes

Yes

Yes

FG484 (23 × 23, 1.0 mm)

 

 

 

 

 

Yes

Yes

*The M1A3P250 device does not support this package

Type (Size, Pitch)

A3PE600

A3PE1500/M1A3PE1500

A3PE3000/M1A3PE3000

PQ208 (28 × 28, 0.5 mm)

 

Yes

Yes

FG256 (17 × 17, 1.0 mm)

Yes

 

 

FG324 (19 × 19, 1.0 mm)

 

 

Yes

FG484 (23 × 23, 1.0 mm)

Yes

Yes

Yes

FG676 (23 × 23, 1.0 mm)

 

Yes

 

FG896 (23 × 23, 1.0 mm)

 

 

Yes

Type (Size, Pitch)

A3PN010

 A3PN015

A3PN020

A3PN060

A3PN125

A3PN250

QN48 (6 × 6, 0.4 mm)

Yes

  

 

 

 

 

QN(G)68 (8 × 8, 0.5 mm)

 

 Yes

Yes

 

 

 

VQ100 (14 × 14, 0.5 mm)

 

  

 

Yes

Yes

Yes

Type (Size, Pitch)

A3P600L/M1A3P600L

A3P1000L/M1A3P1000L

A3PE600L

A3PE3000L/M1A3PE3000L

PQ208 (28 × 28, 0.5 mm)

 

 

 

Yes

FG144 (13 × 13, 0.5 mm)

Yes

Yes

 

 

FG256 (17 × 17, 1.0 mm)

 

Yes

 

 

FG324 (19 × 19, 1.0 mm)

 

 

 

Yes*

FG484 (23 × 23, 1.0 mm)

Yes

 

Yes

Yes

FG896 (31 × 31, 1.0 mm)

 

 

 

Yes

*This Package is discontinued for M1A3PE3000L

Type (Size, Pitch)

AGL030

AGL060

AGL125

AGL250/M1AGL250

AGL400

AGL600/M1AGL600

AGL1000/M1AGL1000

AGLE3000/M1AGLE3000

QN48 (6 × 6, 0.4 mm)

Yes

 

 

 

 

 

 

 

CS81 (5 × 5, 0.5 mm)

Yes

 

 

 

 

 

 

 

VQ100 (14 × 14, 0.5 mm)

Yes

Yes

Yes

Yes

 

 

 

 

CS196 (8 × 8, 0.5 mm)*

 

 

Yes

Yes

Yes

 

 

 

FG144 (13 × 13,1.0 mm)

 

 

Yes

Yes

 

Yes

Yes

 

FG256 (17 × 17, 1.0 mm)

 

 

 

 

Yes

Yes

Yes

 

CS281 (10 × 10, 0.5 mm)

 

 

 

 

 

Yes

Yes

 

FG484 (23 × 23, 1.0 mm)

 

 

 

 

 

 

Yes

Yes

*The M1AGL250 device does not support this package

Type (Size, Pitch)

AGLN010

 AGLN015

AGLN020

AGLN060

AGLN125

AGLN250

UCG36 (3 × 3, 0.4 mm)

Yes

  

 

 

 

 

QNG48 (6 × 6, 0.4mm)

Yes

  

 

 

 

 

QNG68 (8 × 8, 0.4 mm)

 

 Yes

Yes

 

 

 

CSG81 (5 × 5, 0.5 mm)

 

  

Yes

Yes

Yes

Yes

VQG100 (14 × 14, 0.5 mm)

 

  

 

Yes

Yes

Yes

Type (Size, Pitch)

AGLP030

VQ128 (14 × 14, 0.4 mm)

Yes

Type (Size, Pitch)

A2F200M3F

A2F500M3G

PQ208 (28 × 28, 0.5 mm)

Yes

Yes

CS288 (11 × 11, 0.5 mm)

Yes

Yes

FG256 (17 × 17, 1.0 mm)

Yes

Yes

FG484 (23 × 23, 1.0 mm)

Yes

Yes

Type (Size, Pitch)

RTPF500

CG1509 (40 × 40,
1.0 mm)

Yes

LG1509 (40 × 40,
1.0 mm)

Yes

(Size, Pitch)

CG/LG/CB1657 

 CQ352  FCG/FC1657

42.5 mm × 42.5 mm

Yes

    

42.5 mm × 42.5 mm

 

   Yes

48 mm × 48 mm
 		            Yes  

Type (Pitch)

RT3PE600L

 RT3PE3000L 

CQ256 (1.0mm)

Yes

 Yes
CG484/LG484 (1.0mm) Yes Yes

Documentation

Search Documentation
Showing for
Document Category Title Date
RTG4-FCG1657 Daisy Chain Package User Guide 		06 Apr 2023
RTG4 - CG1657 Daisy Chain Package Pin Connections 		06 Apr 2023
RTG4 - CG1657 Daisy Chain Package User Guide 		06 Apr 2023
User Guides
PolarFire SoC FPGA Packaging and Pin Description User Guide 		02 Oct 2023
Information Sheet
Plastic Package Information for RTG4™ Sub-QML FPGAs 		20 Dec 2023
Packaging Specifications
PolarFire FPGA Packaging and Pin Descriptions User Guide 		10 Dec 2023
Packaging Specifications
Microchip SoC RoHS Certificate of Compliance 		07 May 2013
Packaging Specifications
Backward Compatibility of RoHS Compliant components 		07 May 2013
Packaging Specifications
Environmental Policy 		07 May 2013
Packaging Specifications
Solder Reflow Profile for Standard and Lead-Free Packages 		07 May 2013
Packaging Specifications
Prohibitive Substances 		07 May 2013
Packaging Specifications
EU RoHS and PFOS, PFOA, and Deca-BDE Compliance Customer Letter 		07 May 2013
Packaging Specifications
Environmental FAQs 		07 May 2013
Packaging Specifications
Green Packaging Brochure 		07 May 2013
Packaging Specifications
Microchip Position On REACH SVHC 191 		03 Feb 2019
Packaging Specifications
Package Thermal Characteristics and Weights 		05 Jun 2003
Packaging Specifications
Hermetic Package MechanicalConfiguration 		15 Jan 2003
Packaging Specifications
Mechanical Drawings for the RTSX Adapter Board 		05 Jun 2003
Package Material Information 		24 Mar 2023
Packaging Specifications
Use of Pure Tin Components Intended for Space Application 		07 May 2013
Packaging Specifications
Sockets for Microchip FPGAs 		07 May 2013
Packaging Specifications
CCGA Board Level Testing Report 		07 May 2013
Packaging Specifications
Prototyping Socket Electrical data list 		07 May 2013
Packaging Specifications
PQFP Handling Instructions 		07 May 2013
Packaging Specifications
Visual Inspection Criteria for Microchip CQFP Packages 		07 May 2013
Packaging Specifications
Tray Drawings 		04 Jun 2003
Packaging Specifications
Socket Assembly Instructions for QFP and BGA (Ball Grid Array) packages 		07 May 2013
Packaging Specifications
Plastic Packages Containing a Heat Spreader 		07 May 2013
Packaging Specifications
BGA Handling Instructions 		07 May 2013
Packaging Specifications
Leadframe Rework on Microchip CQFP Packages 		07 May 2013
Brochures
FPGA and SoC Brochure 		13 Jun 2023
Packaging Specifications
Moisture Sensitivity 		07 May 2013
Packaging Specs
Sony Green Partner Certification 		11 Jan 2024
Packaging Specifications
Tape&ReelPackaging 		07 May 2013
Supporting Collateral
PD3068: Package Mechanical Drawings Datasheet 		17 Feb 2023
Application Notes
AC174: Assembly Instructions for CQFP Packages SMT on PCB 		06 May 2013
Application Notes
AC441: Storage and Shelf Life of Microchip FPGAs in Plastic Packages 		02 Jun 2015
Application Notes
AC220: Package Thermal Characteristics 		06 May 2013
Application Notes
AC243: Assembly and PCB Layout Guidelines for Chip-Scale Packages 		06 May 2013
Application Notes
AC275: Actel CCGA to FBGA Adapter Socket Instructions App Note 		07 Oct 2003 Design Files
Application Notes
AC195: Prototyping for the RT54SX-S Enhanced Aerospace FPGA 		14 Jan 2003 Design Files
Application Notes
AC322: Assembly and PCB Layout Guidelines for QFN Packages 		06 May 2013
Application Notes
AC190: Ceramic Column Grid Array Application Note 		07 Oct 2003
Application Notes
AC193: Ceramic Chip Carrier Land Grid (CC256) Package Handling App Note 		23 Nov 2003
Application Notes
AC274: Microchip CQFP to FBGA Adapter Sockets 		18 Jan 2004 Design Files
Application Notes
AC341: Microsemi CCGA to CLGA Adapter Socket Application Note 		03 Mar 2010
Application Notes
AC342: CQFP to CLGA Adapter Socket Application Note 		03 Mar 2010
Board Design Files
EIA Standard Board Layout Drawing for BGA, CCGA, CSP, and QFN 		07 May 2013
Packaging Specifications
EIA Standard Board Layout of Soldered Pad for QFP Devices and QFP Surface Mount Socket 		07 May 2013
Packaging Specifications
EIA Standard board layout drawing for PLCC package 		07 May 2013
RTPF500-LG1509 Package Drawing 		06 Apr 2023
RTPF500-CG1509 Package Drawing 		06 Apr 2023
RTG4-LG1657 Package Drawing 		06 Apr 2023
RTG4-CB1657 Package Drawing 		06 Apr 2023
RTG4-CQ352 Package Drawing 		06 Apr 2023
Packaging Specifications
RTG4-CG1657 Package Drawing 		18 Nov 2014
Packaging Specifications
RTG4 FPGA Pin Descriptions Datasheet 		21 Sep 2023
RTG4 - FC1657 Package Pin Assignment Table 		25 Apr 2023
RTG4 CQ352 Package Pin Assignment Table 		25 Apr 2023
RTG4 FPGA FCG1657 Package Drawing 		25 Apr 2023
Packaging Specifications
RTG4 FPGA: CG1657 LG1657 CB1657 Package Pin Assignment Table 		25 Apr 2023
Document Category
Title
Date
RTG4-FCG1657 Daisy Chain Package User Guide
06 Apr 2023
Document Category
Title
Date
RTG4 - CG1657 Daisy Chain Package Pin Connections
06 Apr 2023
Document Category
Title
Date
RTG4 - CG1657 Daisy Chain Package User Guide
06 Apr 2023
Document Category
Title
Date
User Guides
PolarFire SoC FPGA Packaging and Pin Description User Guide
02 Oct 2023
Document Category
Title
Date
Information Sheet
Plastic Package Information for RTG4™ Sub-QML FPGAs
20 Dec 2023
Document Category
Title
Date
Packaging Specifications
PolarFire FPGA Packaging and Pin Descriptions User Guide
10 Dec 2023
Document Category
Title
Date
Packaging Specifications
Microchip SoC RoHS Certificate of Compliance
07 May 2013
Document Category
Title
Date
Packaging Specifications
Backward Compatibility of RoHS Compliant components
07 May 2013
Document Category
Title
Date
Packaging Specifications
Environmental Policy
07 May 2013
Document Category
Title
Date
Packaging Specifications
Solder Reflow Profile for Standard and Lead-Free Packages
07 May 2013
Document Category
Title
Date
Packaging Specifications
Prohibitive Substances
07 May 2013
Document Category
Title
Date
Packaging Specifications
EU RoHS and PFOS, PFOA, and Deca-BDE Compliance Customer Letter
07 May 2013
Document Category
Title
Date
Packaging Specifications
Environmental FAQs
07 May 2013
Document Category
Title
Date
Packaging Specifications
Green Packaging Brochure
07 May 2013
Document Category
Title
Date
Packaging Specifications
Microchip Position On REACH SVHC 191
03 Feb 2019
Document Category
Title
Date
Packaging Specifications
Package Thermal Characteristics and Weights
05 Jun 2003
Document Category
Title
Date
Packaging Specifications
Hermetic Package MechanicalConfiguration
15 Jan 2003
Document Category
Title
Date
Packaging Specifications
Mechanical Drawings for the RTSX Adapter Board
05 Jun 2003
Document Category
Title
Date
Package Material Information
24 Mar 2023
Document Category
Title
Date
Packaging Specifications
Use of Pure Tin Components Intended for Space Application
07 May 2013
Document Category
Title
Date
Packaging Specifications
Sockets for Microchip FPGAs
07 May 2013
Document Category
Title
Date
Packaging Specifications
CCGA Board Level Testing Report
07 May 2013
Document Category
Title
Date
Packaging Specifications
Prototyping Socket Electrical data list
07 May 2013
Document Category
Title
Date
Packaging Specifications
PQFP Handling Instructions
07 May 2013
Document Category
Title
Date
Packaging Specifications
Visual Inspection Criteria for Microchip CQFP Packages
07 May 2013
Document Category
Title
Date
Packaging Specifications
Tray Drawings
04 Jun 2003
Document Category
Title
Date
Packaging Specifications
Socket Assembly Instructions for QFP and BGA (Ball Grid Array) packages
07 May 2013
Document Category
Title
Date
Packaging Specifications
Plastic Packages Containing a Heat Spreader
07 May 2013
Document Category
Title
Date
Packaging Specifications
BGA Handling Instructions
07 May 2013
Document Category
Title
Date
Packaging Specifications
Leadframe Rework on Microchip CQFP Packages
07 May 2013
Document Category
Title
Date
Brochures
FPGA and SoC Brochure
13 Jun 2023
Document Category
Title
Date
Packaging Specifications
Moisture Sensitivity
07 May 2013
Document Category
Title
Date
Packaging Specs
Sony Green Partner Certification
11 Jan 2024
Document Category
Title
Date
Packaging Specifications
Tape&ReelPackaging
07 May 2013
Document Category
Title
Date
Supporting Collateral
PD3068: Package Mechanical Drawings Datasheet
17 Feb 2023
Document Category
Title
Date
Application Notes
AC174: Assembly Instructions for CQFP Packages SMT on PCB
06 May 2013
Document Category
Title
Date
Application Notes
AC441: Storage and Shelf Life of Microchip FPGAs in Plastic Packages
02 Jun 2015
Document Category
Title
Date
Application Notes
AC220: Package Thermal Characteristics
06 May 2013
Document Category
Title
Date
Application Notes
AC243: Assembly and PCB Layout Guidelines for Chip-Scale Packages
06 May 2013
Document Category
Title
Date
Application Notes
AC275: Actel CCGA to FBGA Adapter Socket Instructions App Note
07 Oct 2003
Document Category
Title
Date
Application Notes
AC195: Prototyping for the RT54SX-S Enhanced Aerospace FPGA
14 Jan 2003
Document Category
Title
Date
Application Notes
AC322: Assembly and PCB Layout Guidelines for QFN Packages
06 May 2013
Document Category
Title
Date
Application Notes
AC190: Ceramic Column Grid Array Application Note
07 Oct 2003
Document Category
Title
Date
Application Notes
AC193: Ceramic Chip Carrier Land Grid (CC256) Package Handling App Note
23 Nov 2003
Document Category
Title
Date
Application Notes
AC274: Microchip CQFP to FBGA Adapter Sockets
18 Jan 2004
Document Category
Title
Date
Application Notes
AC341: Microsemi CCGA to CLGA Adapter Socket Application Note
03 Mar 2010
Document Category
Title
Date
Application Notes
AC342: CQFP to CLGA Adapter Socket Application Note
03 Mar 2010
Document Category
Title
Date
Board Design Files
EIA Standard Board Layout Drawing for BGA, CCGA, CSP, and QFN
07 May 2013
Document Category
Title
Date
Packaging Specifications
EIA Standard Board Layout of Soldered Pad for QFP Devices and QFP Surface Mount Socket
07 May 2013
Document Category
Title
Date
Packaging Specifications
EIA Standard board layout drawing for PLCC package
07 May 2013
Document Category
Title
Date
RTPF500-LG1509 Package Drawing
06 Apr 2023
Document Category
Title
Date
RTPF500-CG1509 Package Drawing
06 Apr 2023
Document Category
Title
Date
RTG4-LG1657 Package Drawing
06 Apr 2023
Document Category
Title
Date
RTG4-CB1657 Package Drawing
06 Apr 2023
Document Category
Title
Date
RTG4-CQ352 Package Drawing
06 Apr 2023
Document Category
Title
Date
Packaging Specifications
RTG4-CG1657 Package Drawing
18 Nov 2014
Document Category
Title
Date
Packaging Specifications
RTG4 FPGA Pin Descriptions Datasheet
21 Sep 2023
Document Category
Title
Date
RTG4 - FC1657 Package Pin Assignment Table
25 Apr 2023
Document Category
Title
Date
RTG4 CQ352 Package Pin Assignment Table
25 Apr 2023
Document Category
Title
Date
RTG4 FPGA FCG1657 Package Drawing
25 Apr 2023
Document Category
Title
Date
Packaging Specifications
RTG4 FPGA: CG1657 LG1657 CB1657 Package Pin Assignment Table
25 Apr 2023
Application Notes
Board Layout

Application Notes

Title
PD3068: Package Mechanical Drawings Datasheet Download
AC174: Assembly Instructions for CQFP Packages SMT on PCB Download
AC441: Storage and Shelf Life of Microchip FPGAs in Plastic Packages Download
AC220: Package Thermal Characteristics Download
AC243: Assembly and PCB Layout Guidelines for Chip-Scale Packages Download
AC275: Actel CCGA to FBGA Adapter Socket Instructions App Note Download Design Files
AC195: Prototyping for the RT54SX-S Enhanced Aerospace FPGA Download Design Files
AC322: Assembly and PCB Layout Guidelines for QFN Packages Download
AC190: Ceramic Column Grid Array Application Note Download
AC193: Ceramic Chip Carrier Land Grid (CC256) Package Handling App Note Download
AC274: Microchip CQFP to FBGA Adapter Sockets Download Design Files
AC341: Microsemi CCGA to CLGA Adapter Socket Application Note Download
AC342: CQFP to CLGA Adapter Socket Application Note Download

Board Layout Drawings

Title
EIA Standard Board Layout Drawing for BGA, CCGA, CSP, and QFN Download Design Files
EIA Standard Board Layout of Soldered Pad for QFP Devices and QFP Surface Mount Socket Download
EIA Standard board layout drawing for PLCC package Download
RT PolarFire® FPGAs
RTG4™ FPGAs

RT Polarfire®  FPGAs

Title
RTPF500-LG1509 Package Drawing Download
RTPF500-CG1509 Package Drawing Download

RTG4™ FPGAs

Title
RTG4-LG1657 Package Drawing Download
RTG4-CB1657 Package Drawing Download
RTG4-CQ352 Package Drawing Download
RTG4-CG1657 Package Drawing Download
RTG4 FPGA Pin Descriptions Datasheet Download
RTG4 - FC1657 Package Pin Assignment Table Download
RTG4 CQ352 Package Pin Assignment Table Download
RTG4 FPGA FCG1657 Package Drawing Download
RTG4 FPGA: CG1657 LG1657 CB1657 Package Pin Assignment Table Download
Title
RTG4-FCG1657 Daisy Chain Package User Guide Download
RTG4 - CG1657 Daisy Chain Package Pin Connections Download
RTG4 - CG1657 Daisy Chain Package User Guide Download
PolarFire SoC FPGA Packaging and Pin Description User Guide Download
Plastic Package Information for RTG4™ Sub-QML FPGAs Download
PolarFire FPGA Packaging and Pin Descriptions User Guide Download
Title
Microchip SoC RoHS Certificate of Compliance Download
Backward Compatibility of RoHS Compliant components Download
Environmental Policy Download
Solder Reflow Profile for Standard and Lead-Free Packages Download
Prohibitive Substances Download
EU RoHS and PFOS, PFOA, and Deca-BDE Compliance Customer Letter Download
Environmental FAQs Download
Green Packaging Brochure Download
Microchip Position On REACH SVHC 191 Download
Package Thermal Characteristics and Weights Download
Hermetic Package MechanicalConfiguration Download
Mechanical Drawings for the RTSX Adapter Board Download
Package Material Information Download
Use of Pure Tin Components Intended for Space Application Download
Sockets for Microchip FPGAs Download
CCGA Board Level Testing Report Download
Prototyping Socket Electrical data list Download
PQFP Handling Instructions Download
Visual Inspection Criteria for Microchip CQFP Packages Download
Tray Drawings Download
Socket Assembly Instructions for QFP and BGA (Ball Grid Array) packages Download
Plastic Packages Containing a Heat Spreader Download
BGA Handling Instructions Download
Leadframe Rework on Microchip CQFP Packages Download
FPGA and SoC Brochure Download
Moisture Sensitivity Download
Sony Green Partner Certification Download
Tape&ReelPackaging Download

Web Resources