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Leading-Edge Advanced Semiconductor Packaging Services


Our leading-edge services include:

  • Microelectronic product design
  • Turnkey assemblies
  • Qualification
  • Supply chain management
  • Failure analysis

We will work closely with you to meet your semiconductor packaging requirements, reduce your development and manufacturing costs, reduce risk and bring your product to market quickly.

Microchip Advanced Packaging Services

The Microchip Advanced Packaging Services site is located in Caldicot, South Wales, UK. With a history of innovating for more than 30 years, our team offers extensive knowledge and expertise to fully support cutting-edge projects and design innovative technology that will give you a competitive edge in your market.

Our expertise lies in our precise, secure assemblies to create components that can withstand harsh environments such as extreme temperatures and pressures. We can adapt our solutions to cater to your Size, Weight and Power (SWaP) and security requirements. Our IP-protected products are designed, manufactured and tested in our Caldicot facility to deliver full supply chain management of your project. 

Key Capabilities


In addition to the many services we offer, we specialize in custom semiconductor packages for our clients. These are our four key technologies:

Expert Assembling Microelectronics

Microelectronics Assembly Services

Do you want world-class products that meet your specific Size, Weight and Power requirements?

Benefits for you:

  • Scalable manufacturing process 
  • Rapid prototyping
  • Full supply chain management
Microelectronic Miniaturization Services

Microelectronic Miniaturization Services

Do you need a technology for embedding components that enables them to occupy a near-zero area?

Benefits for you:

  • Significant size reduction 
  • Low cost of entry
  • Fast turnaround time 
Si IGBT and SiC MOSFET Using Power Module

Complex Power Module Services

Do you require power modules that are suitable for the most demanding applications?

Benefits for you:

  • High power density
  • High efficiency 
  • Module customization  
Expert With Modern Semiconductor Coating Technology

Large Area Panel Molding Services

Do you need minimal tooling and a quick turnaround time?

Benefits for you:

  • Low cost of entry 
  • Flexible size and shape 
  • High reliability

Contact Us


Microchip Advanced Packaging Services
Phase 2, Castlegate Business Park, Unit 4, Caldicot
Monmouthshire, South Wales, UK
NP26 5YW

Email Address: Info-Caldicot@microchip.com
Phone Number: (+44) 01291 435351

Caldicot Microchip Advanced Packaging Services UK Location